Capacitor attachment method

Details Capacitor attachment method Capacitor attachment method

2006-02-28

2008-11-18

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21506, C257SE21511, C257SE21513

Reexamination Certificate

active

07452750

ABSTRACT:
A method of attaching a capacitor (112) to a substrate (100) includes applying a flux (108) to respective capacitor pads (104, 106) on the substrate (100). The capacitor (112) is placed on the fluxed capacitor pads (104, 106) and a reflow operation is performed on the capacitor (112) and the substrate (100) such that intermetallic interconnects (128) are formed between the capacitor (112) and the substrate (100).

REFERENCES:
patent: 5210683 (1993-05-01), Ley
patent: 5684677 (1997-11-01), Uchida et al.
patent: 6145735 (2000-11-01), Mallery et al.
patent: 6790293 (2004-09-01), Nomura et al.
patent: 7319048 (2008-01-01), Lu et al.
patent: 2001/0040006 (2001-11-01), Pompeo et al.
patent: 2002/0195170 (2002-12-01), Normura et al.

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