Capacitor and process for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE27089, C438S398000

Reexamination Certificate

active

07667257

ABSTRACT:
Method for solving the problem caused when forming a crown-structure capacitor in a trench which is formed in an insulating film, and having difficulty in electrical by connecting a first upper electrode formed on the inside wall of the trench and a second upper electrode which is to be a plate because of the intervention of dielectric between the first and second upper electrodes. The conducting state of the first upper electrode and the plate upper electrode is ensured by utilizing a tantalum oxide film formed on a titanium nitride film, which is brought to a completely conducting state when heat treated. A crown structure is formed without removing the insulating film, in which a trench has been formed, by wet etching, whereby a stacked trench capacitor, which has double the capacity is provided while eliminating the collapse of the lower electrode or pair bit defect.

REFERENCES:
patent: 2004/0227175 (2004-11-01), Iijima et al.
patent: 2004/0248362 (2004-12-01), Nakamura et al.
patent: 2006/0234510 (2006-10-01), Iijima
patent: 10-173148 (1998-06-01), None

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