Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-02-05
1994-07-26
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
296211, 73718, 73724, 156644, 156656, 156657, 156662, 437228, 437233, 437901, 437921, H01L 21306, B44C 122, C03C 1500, C23F 100
Patent
active
053324692
ABSTRACT:
A surface layer and a sacrificial layer are deposited on a substrate. A conductive structural layer bridges over the sacrificial layer and is anchored to the surface layer for creating paired conductive areas. A backside opening is etched in the substrate for defining a flexible diaphragm layer of reduced thickness. The sacrificial layer is removed so that pressures exerted on the backside opening will cause a change in capacitance between the paired conductive areas. Temporary posts support the conductive structural layer as the sacrificial layer is removed.
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Dixon Richard D.
Ford Motor Company
May Roger L.
Powell William
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