Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-02-05
1994-05-31
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156650, 156657, 1566591, 156662, 437233, 437919, 73715, H01L 21306, B44C 122
Patent
active
053166191
ABSTRACT:
A polysilicon diaphragm is formed on top of a sacrificial layer deposited upon a semiconductor substrate, where the thickness of the layer is controllable. The sacrificial layer is removed to define a diaphragm cavity, which is sealed with a plug. Electrodes within the surfaces defining the cavity deflect in response to variations in pressure, while providing a very small and minimum parasitic capacitance.
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Dixon Richard D.
Ford Motor Company
May Roger L.
Powell William
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