Capacitive multidrop bus compensation

Details Capacitive multidrop bus compensation Capacitive multidrop bus compensation

2011-03-22

2011-03-22

Zaman, Faisal M (Department: 2111)

Electrical computers and digital data processing systems: input/

Intrasystem connection

C710S110000, C327S109000, C333S017300, C333S032000, C333S124000

Reexamination Certificate

active

07913005

ABSTRACT:
The signal integrity of a high speed heavily loaded multidrop memory bus is often degraded due the numerous impedance mismatches. The impedance mismatches causes the bus to exhibit a nonlinear frequency response, which diminishes signal integrity and limits the bandwidth of the bus. A compensating element, such as a capacitor which ties the bus to a reference plane (e.g., a ground potential), or an inductor wired in series with the bus, is located approximately midway between the memory controller and the memory slots. The use of the compensating element equalizes signal amplitudes and minimizes phase errors of signals in an interested frequency range and diminishes the amplitudes of high frequency signals which exhibit high degrees of phase error. The resulting bus structure has increased desirable harmonic content with low phase error, thereby permitting the bus to exhibit better rise time performance and permitting a higher data transfer rate.

REFERENCES:
patent: 4314288 (1982-02-01), Gyi
patent: 4320521 (1982-03-01), Balakrishnan et al.
patent: 4533993 (1985-08-01), McCanny et al.
patent: 4604683 (1986-08-01), Russ et al.
patent: 5151996 (1992-09-01), Hillis
patent: 5291609 (1994-03-01), Herz
patent: 5343503 (1994-08-01), Goodrich
patent: 5394544 (1995-02-01), Motoyama et al.
patent: 5497373 (1996-03-01), Hulen et al.
patent: 5530894 (1996-06-01), Farrell et al.
patent: 5537654 (1996-07-01), Bedingfield et al.
patent: 5568621 (1996-10-01), Wooten
patent: 5574861 (1996-11-01), Lorvig et al.
patent: 5586181 (1996-12-01), Kiko
patent: 5621900 (1997-04-01), Lane et al.
patent: 5638402 (1997-06-01), Osaka et al.
patent: 5682328 (1997-10-01), Roeber et al.
patent: 5682552 (1997-10-01), Kuboki et al.
patent: 5687346 (1997-11-01), Shinohara
patent: 5710932 (1998-01-01), Hamanaka et al.
patent: 5715411 (1998-02-01), Verdun
patent: 5727182 (1998-03-01), Fukushima et al.
patent: 5734208 (1998-03-01), Jones
patent: 5754792 (1998-05-01), Shutoh et al.
patent: 5790879 (1998-08-01), Wu
patent: 5801715 (1998-09-01), Norman
patent: 5802325 (1998-09-01), Le Roux
patent: 5822548 (1998-10-01), Story et al.
patent: 5822608 (1998-10-01), Dieffenderfer et al.
patent: 5832245 (1998-11-01), Gulick
patent: 5857084 (1999-01-01), Klein
patent: 5926031 (1999-07-01), Wallace et al.
patent: 5933041 (1999-08-01), Sessions et al.
patent: 5935223 (1999-08-01), Griffith et al.
patent: 5945886 (1999-08-01), Millar
patent: 6035354 (2000-03-01), Klein
patent: 6067594 (2000-05-01), Perino et al.
patent: 6078515 (2000-06-01), Nielsen et al.
patent: 6094091 (2000-07-01), Okajima
patent: 6112275 (2000-08-01), Curry et al.
patent: 6256235 (2001-07-01), Lee
patent: 6298066 (2001-10-01), Wettroth et al.
patent: 6434647 (2002-08-01), Bittner, Jr.
patent: 6745268 (2004-06-01), Greeff et al.
patent: 6820163 (2004-11-01), McCall et al.
patent: 6871253 (2005-03-01), Greeff et al.
patent: 6882082 (2005-04-01), Greeff et al.
patent: 6934785 (2005-08-01), Lee et al.
patent: 6981089 (2005-12-01), Dodd et al.
patent: 7133926 (2006-11-01), Jones et al.
patent: 7254663 (2007-08-01), Bartley et al.
patent: 7287108 (2007-10-01), Greeff et al.
patent: 7461188 (2008-12-01), Greeff et al.
patent: 474907 (1992-03-01), None
patent: 942555 (1999-09-01), None
patent: 1881414 (2008-01-01), None
patent: 61187056 (1986-08-01), None
patent: 02067840 (1990-03-01), None
patent: 03063750 (1991-03-01), None
patent: 08335204 (1996-12-01), None
patent: 408335204 (1996-12-01), None
patent: WO 9922489 (1999-05-01), None
patent: WO 0225454 (2002-03-01), None
Institute of Electrical and Electronics Engineers, Inc., “The Authoritative Dictionary of IEEE Standards Terms”, 2000, IEEE Press Standards Information Network, Seventh Edition, p. 388.
“NN890754: Data Funnel for Connection of Multiple Channel Types”, Jul. 1, 1989, IBM Corporation, IBM Technical Disclosure Bulletin, Jul. 1989, vol. 32, Issue 2, pp. 54-55.
“NN9111415: Means of Implementing a Computer Bus Using Optical Waveguides”, Nov. 1, 1991, IBM Corporation, IBM Technical Disclosure Bulletin, Nov. 1991, vol. 34, Issue 6, pp. 415-417.
“NN950351: Programmable Split Terminator”, Mar. 1, 1995, IBM Corporation, IBM Technical Disclosure Bulletin, Mar. 1995, vol. 38, Issue 3, pp. 51-52.
Kim et al. , “A 5.6-mW 1-Gb/s/pair pulsed signaling transceiver for a fully AC coupled bus,” Jun. 2005, IEEE, IEEE Journal of Solid-State Circuits, vol. 40, No. 6, pp. 1331-1340.
Intel 815 Chipset Platform, Design Guide, Jun. 2000, pp. 1-16, 21 and 51-60.
Wirick et al., “Design and Modeling Challenges for DDR II Memory Subsystems”, Electrical Performance of Electronic Packaging, 2003, pp. 229-232, Oct. 27-29, 2003.
Nemec, J., “Circuit termination methodologies and their characteristics,” Wescon/97. Conference Proceedings, pp. 556-561, Nov. 4-6, 1997.
Sledjeski, Lee, “Considerations for Bus Termination in Computing Systems”, 1999, International IC '99 Conference Proceedings, pp. 223-228.
Institute of Electrical and Electronics Engineers, Inc., “The Authoritative Dictionary of IEEE Standards Terms”, 2000, IEEE Press Standards Information Network, Seventh Edition, p. 388.
“RC Filter” and “RL Filter”, Wikipedia.org, retrieved from the Internet on May 10, 2006 at http://en.wikipedia.org/wiki/RC.sub.—filter and http://en.wikipedia.org/wiki/RL.sub.—circuit. cited by examiner.

Affiliated with

Also associated with

Rating

Capacitive multidrop bus compensation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Capacitive multidrop bus compensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitive multidrop bus compensation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2769201