Capacitive interposer

Details Capacitive interposer Capacitive interposer

2005-04-05

2005-04-05

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C361S761000, C361S763000

Reexamination Certificate

active

06875921

ABSTRACT:
A capacitive interposer (caposer) is disposed inside an integrated circuit package between a die and an inside surface of the package. Conductive layers within the caposer constitute a bypass capacitor. In a through-hole caposer, micro-bumps on the die pass through through-holes in the caposer and contact corresponding landing pads on the package. As they pass through the caposer, power and ground micro-bumps make contact with the plates of the bypass capacitor. In a via caposer, power and ground micro-bumps on the die are coupled to power and ground landing pads on the package as well as to the plates of the bypass capacitor by power and ground vias that extend through the caposer.

REFERENCES:
patent: 5633785 (1997-05-01), Parker et al.
patent: 6137161 (2000-10-01), Gilliland et al.
patent: 6144225 (2000-11-01), Lesea
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 6683781 (2004-01-01), Ho et al.
U.S. Appl. No. 10/377,863,filed Feb. 28, 2003, Trimberger et al.
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Actel Corporation; Application Note “The Actel Extender—Extending the Life of Existing Designs”; Jan. 2002; available from Actel Corporation; pp. 1-4.
Fujipoly; Electronic Packaging Components; downloaded Oct. 10, 2003 from Fujipoly; 4 pages.

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