Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Reexamination Certificate
2006-02-21
2006-02-21
Chaudhari, Chandra (Department: 2891)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Electrical characteristic sensed
C438S017000
Reexamination Certificate
active
07001785
ABSTRACT:
A capacitance probe for thin dielectric film characterization provides a highly sensitive capacitance measurement method and reduces the contact area needed to obtain such a measurement. Preferably, the capacitance probe is connected to a measurement system by a transmission line and comprises a center conductive tip and RLC components between the center conductor and the ground of the transmission line. When the probe tip is in contact with a sample, an MIS or MIM structure is formed, with the RLC components and the capacitance of the MIS or MIM structure forming a resonant circuit. By sending a driving signal to the probe and measuring the reflected signal from the probe through the transmission line, the resonant characteristic of the resonant circuit can be obtained. The capacitance of the MIS or MIM structure is obtainable from the resonant characteristics and the dielectric film thickness or other dielectric properties are also extractable.
REFERENCES:
patent: RE32457 (1987-07-01), Matey
patent: 5065103 (1991-11-01), Slinkman et al.
patent: 5514337 (1996-05-01), Groger et al.
patent: 5700953 (1997-12-01), Hlady et al.
patent: 5902928 (1999-05-01), Chen et al.
patent: 6072313 (2000-06-01), Li et al.
patent: 6172506 (2001-01-01), Adderton et al.
patent: 6318159 (2001-11-01), Chen et al.
patent: 6388452 (2002-05-01), Picciotto
patent: 6445194 (2002-09-01), Adkisson et al.
patent: 6459280 (2002-10-01), Bhushan et al.
patent: 6465267 (2002-10-01), Wang et al.
patent: 6472236 (2002-10-01), Wang et al.
patent: 6492827 (2002-12-01), Mazur et al.
patent: 6794886 (2004-09-01), Chen et al.
patent: 2002/0102748 (2002-08-01), Kwon
patent: 2002/0130674 (2002-09-01), Lagawski et al.
patent: WO 01/29568 (2001-04-01), None
Chaudhari Chandra
Patterson Thuente Skaar & Christensen P.A.
Veeco Instruments Inc.
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