Cantilever microprobes for contacting electronic components...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S762010

Reexamination Certificate

active

11029219

ABSTRACT:
Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

REFERENCES:
patent: 5286208 (1994-02-01), Matsuoka
patent: 5599194 (1997-02-01), Ozawa et al.
patent: 6491968 (2002-12-01), Mathieu et al.
patent: 6794890 (2004-09-01), Tokumo et al.
patent: 6856156 (2005-02-01), Liang et al.

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