Calculating etch proximity-correction using image-precision...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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Reexamination Certificate

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10955189

ABSTRACT:
One embodiment of the present invention provides a system that calculates etch proximity-correction during an OPC (Optical Proximity Correction) process. During operation, the system receives a layout for an integrated circuit. Next, the system selects a target point on an edge in the layout. The system then casts a plurality of rays from the target point, and constructs a plurality of pie-wedges based on the cast rays. The system then computes a surface integral of a statistical function over the pie-wedges, wherein the surface integral of the statistical function models the etch bias at the target point. Next, the calculated etch proximity-correction is applied to an area in proximity to the target point.

REFERENCES:
patent: 5847959 (1998-12-01), Veneklasen et al.
patent: 6449103 (2002-09-01), Charles
patent: 7010776 (2006-03-01), Gallatin et al.
patent: 2005/0015233 (2005-01-01), Gordon
patent: 2005/0091631 (2005-04-01), Gallatin et al.
patent: 2005/0273753 (2005-12-01), Sezginer
patent: 2006/0126046 (2006-06-01), Hansen

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