C-BiCMOS semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257370, 257378, 257552, H01L 2702

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active

053192346

ABSTRACT:
There is disclosed a C-BiCMOS semiconductor device in which a base electrode (300) of an NPN bipolar transistor and a drain electrode (360) of a PMOS transistor are formed of the same polycrystalline semiconductor, in which a base electrode (310) of a PNP bipolar transistor and a drain electrode (350) of an NMOS transistor are formed of the same polycrystalline semiconductor, and in which a source electrode (530) of the PMOS transistor and a source electrode (520) of the NMOS transistor are formed of aluminium wiring. The C-BiCMOS semiconductor device achieves preferable electric conductivity in the source electrodes, size reduction in the drain electrodes, and simplified process steps in the formation of the base electrodes of the bipolar transistors, so that the size of the devices is reduced in simple process steps without deterioration of the electric conductivity.

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Kobayashi et al., "High Performance LSI Technology: SST CBi-CMOS", IEDM, 1988, pp. 760-763.
Maeda et al., "Lower Submicron FCBiMOS (Fully Complementary BiMOS) Process with RTP and MeV Implanted 5 GHz Vertical PNP Transistor," IEEE 1990 Symposium on VLSI Technology, 1990, pp. 79-80.

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