Byproduct control in linear chemical mechanical...

Details Byproduct control in linear chemical mechanical... Byproduct control in linear chemical mechanical...

2005-05-10

2005-05-10

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S444000

Reexamination Certificate

active

06890245

ABSTRACT:
In a method for controlling byproduct build-up on a polishing pad, a chemistry is introduced onto the top surface of the polishing pad in the presence of a source of kinetic energy. When the source of kinetic energy is a pressurized gas, the chemistry is sprayed onto the top surface of the polishing pad. When the source of kinetic energy is a brush that applies a force against the top surface of the polishing pad, the brush is used to brush the top surface of the polishing pad while applying the chemistry onto the top surface of the polishing pad through the brush. A CMP system for implementing this method includes one or both of a mixing manifold and a brush.

REFERENCES:
patent: 6186865 (2001-02-01), Thornton et al.
patent: 6350183 (2002-02-01), Manfredi
patent: 6443816 (2002-09-01), Inoue et al.
patent: 6468134 (2002-10-01), Gotkis

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