Bus communication system for stacked high density integrated cir

Details Bus communication system for stacked high density integrated cir Bus communication system for stacked high density integrated cir

1995-07-24

1996-09-03

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

437208, 437915, 257692, 257686, 257777, H05K 700, H01L 2302

Patent

active

055529631

ABSTRACT:
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.

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