Bumping electronic components using transfer substrates

Details Bumping electronic components using transfer substrates Bumping electronic components using transfer substrates

2007-10-16

2010-11-30

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257S780000, C257SE21002

Reexamination Certificate

active

07842599

ABSTRACT:
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of material having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.

REFERENCES:
patent: 5860585 (1999-01-01), Rutledge et al.
patent: 6319810 (2001-11-01), Ochiai et al.
patent: 6448169 (2002-09-01), Brearley et al.
patent: 6936532 (2005-08-01), Sakaida

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