Bumped substrate assembly

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428137, 428172, 428210, 428901, 361748, 361751, B32B 700, H05K 720

Patent

active

060337648

ABSTRACT:
A bumped substrate assembly comprising an alumina substrate a layer of copper on the alumina substrate, and a heterogeneous juncture band between the alumina the copper layer. Copper bumps integrally connected to the copper layer extend therefrom; the copper in the copper layer and the copper bumps is substantially identical. The heterogeneous juncture band has a copper-wetted surface area that is at least about twice the apparent surface area of the copper overlying the first juncture band and consisting essentially of alumina grains unitary with the copper layer and being constituted by finger-like copper protuberances unitary with the copper layer and occupying the space between the alumina grains.

REFERENCES:
patent: 5010314 (1991-04-01), Estrov
patent: 5095357 (1992-03-01), Andoh et al.
patent: 5525402 (1996-06-01), Nakamura et al.
patent: 5608617 (1997-03-01), Morrison et al.
patent: 5629835 (1997-05-01), Mahulikar et al.
patent: 5716713 (1998-02-01), Zsamboky et al.

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