4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Kalman F. Zsamboky

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Bumped substrate assembly

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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High power miniature demand power supply

Electric power conversion systems – Current conversion – Integrated circuit
Patent

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High power miniature demand power supply

Electric power conversion systems – Current conversion – Integrated circuit
Patent

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Metallized ceramic substrate and method therefor

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent

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Metallized ceramic substrate and method therefor

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Profile ID: LFUS-PAI-P-220710

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