Bumped integrated circuits for optical applications

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Encapsulated

Reexamination Certificate

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C257S433000

Reexamination Certificate

active

07012282

ABSTRACT:
An optical integrated circuit application where the integrated circuit is packaged in a clear molding material and is attached to a printed circuit board having an aperture is described. The integrated circuit senses and/or emits light through the clear molding material and through the aperture in the printed circuit board.

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patent: 2004/0178462 (2004-09-01), Sakaguchi et al.

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