Bumped IC, display device and electronic device using the same

Details Bumped IC, display device and electronic device using the same Bumped IC, display device and electronic device using the same

2006-08-29

2006-08-29

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257S659000, C257S738000, C257S778000

Reexamination Certificate

active

07098526

ABSTRACT:
A driver IC, which is mounted on an active matrix substrate by means of COG, is provided. The driver IC includes an input-output circuit, an internal circuit region having a plurality of internal circuits, a plurality of substrate-coupling bumps coupled to the input-output circuit, and at least one dummy bump. The dummy bump is placed facing opposite to one of the plurality of internal circuits which becomes an object of light shielding.

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