Bump style MEMS switch

Details Bump style MEMS switch Bump style MEMS switch

2006-10-10

2006-10-10

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S461000

Reexamination Certificate

active

07118935

ABSTRACT:
A microelectromechanical system switch may be formed with a protrusion defined on the substrate which makes contact with a deflectable member arranged over the substrate. The deflectable member may, for example, be a cantilevered arm or a deflectable beam. The protrusion may be formed in the substrate in one embodiment using field oxide techniques.

REFERENCES:
patent: 5472916 (1995-12-01), Bertagnolli et al.
patent: 5789269 (1998-08-01), Mehta et al.
patent: 5940711 (1999-08-01), Zambrano
patent: 2002/0055260 (2002-05-01), Chow et al.
patent: 2002/0097118 (2002-07-01), Siekkinen et al.
patent: 2003/0127698 (2003-07-01), Lee
patent: WO 02/073645 (2002-09-01), None

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