Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2001-02-28
2002-08-27
Dunn, Tom (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S001100, C228S009000, C228S110100, C073S001820, C073S582000, C073S584000
Reexamination Certificate
active
06439447
ABSTRACT:
TECHNICAL FIELD
The present invention relates to an apparatus and a method for deciding whether a bump formed on either one of an electronic component and a circuit board is joined good to an electrode portion of the other, for example, when the bump formed on an electrode of the electronic component is connected to an electrode part on the circuit board to manufacture a semiconductor component, and an apparatus with the bump joining determination apparatus and a method for manufacturing semiconductor components.
BACKGROUND ART
In order for electrically connecting and fixing an electronic component onto a circuit board, there is a method whereby bumps formed on either one of the electronic component and the circuit board are joined to electrode portions of the other. The description hereinafter will be directed to a method of joining the bumps formed on electrodes of the electronic component to electrode parts on the circuit board. An apparatus which executes the bump join method is, e.g., a semiconductor component manufacturing apparatus
1
shown in FIG.
30
. The semiconductor component manufacturing apparatus
1
roughly comprises a component feed apparatus
2
, a bonding stage
3
, a component reverse apparatus
4
, a bump join apparatus
5
, and a circuit board transfer apparatus
6
.
The component feed apparatus
2
is an apparatus for feeding semiconductor chips as an example of the aforementioned electronic component. The circuit board transfer apparatus
6
carries a circuit board
20
in and out of the semiconductor component manufacturing apparatus
1
. The bonding stage
3
is a stage for loading the circuit board
20
carried in by the circuit board transfer apparatus
6
for the bump joining, which can be moved in a Y-direction by a Y-axis robot
7
and heats the circuit board
20
for the bump joining. The component reverse apparatus
4
holds the semiconductor chip from the component feed apparatus
2
and turns the held semiconductor chip upside down so that bumps formed on electrodes
13
of the semiconductor chip face the circuit board
20
placed on the bonding stage
3
. The bump join apparatus
5
includes a holding device for holding the semiconductor chip, a Z-direction driving device
51
for moving the held semiconductor chip in a thickness-direction, and an ultrasonic vibration generating device
9
which will be detailed later. The bump join apparatus
5
is mounted to an X-axis robot
8
and can be moved in an X-direction by the X-axis robot
8
. After receiving the semiconductor chip from the component reverse apparatus
4
and transferring it to the bonding stage
3
, the bump join apparatus
5
presses the held semiconductor chip by driving the Z-direction driving device
5
to a predetermined position of the circuit board
20
placed on the bonding stage
3
, thereby joining the bumps. The bump, before being pressed to an electrode part
21
of the circuit board
20
, keeps a shape as shown in
FIG. 32
, having a diameter I of approximately 100 &mgr;m, a height III at a base part
11
a
on the electrode
13
of the semiconductor chip
150
of approximately 30-35 &mgr;m, and a total height II of approximately 70-75 &mgr;m. The pressed bump after being crushed (the pressed bump
11
will be denoted by a reference numeral “12” hereinbelow) is shaped as illustrated in
FIG. 33. A
height IV of the pressed bump
12
is approximately equal to the height III of the base part
11
a.
The semiconductor chip to be joined onto the circuit board
20
is located by the X-axis robot
8
and Y-axis robot
7
.
The bump join apparatus
5
is equipped with the ultrasonic vibration generating device
9
for vibrating the bumps
11
in the Y-direction or X-direction thereby generating a frictional heat between the bumps
11
and the electrode parts
21
of the circuit board
20
, and reducing a heating temperature of the bonding stage
3
to tightly unite the bumps
11
. The ultrasonic vibration generating device
9
has, as shown in
FIG. 31
, piezoelectric elements
91
and an ultrasonic horn
92
having one end part connected to the piezoelectric element
91
. Ultrasonic vibration is generated when a voltage is placed to the plurality of the layered piezoelectric elements
91
. The generated vibration, for instance, in the Y-direction is amplified by the ultrasonic horn
92
. A nozzle
93
for holding the semiconductor chip
150
is fixed to the other end part of the ultrasonic horn
92
. The above vibration of the piezoelectric elements
91
vibrates the nozzle
93
, namely, semiconductor chip
150
held by the nozzle
93
in the Y-direction. Although the piezoelectric elements
91
vibrate, e.g., in the Y-direction, vibrations in various directions are generated in a process while the generated vibration being transmitted to the semiconductor chip
150
. Therefore, the semiconductor chip
150
vibrates actually in various directions although it primarily vibrates in the Y-direction.
In the above-described conventional semiconductor component manufacturing apparatus
1
, after the bumps
11
of the electronic component are pressed to the circuit board
20
heated to approximately 150° C. on the bonding stage
3
, the bumps
11
are ultrasonically vibrated via the electronic component, whereby the frictional heat is generated between the bumps
11
and electrode parts
21
to join the bumps and electrode parts.
Joining the bumps
11
and electrode parts
21
in this manner allowed portable telephones and personal computers to be made more compact and light-weight. However, whether the joining is good or not was not determined during the joining process in the conventional method. The joining at narrow-pitch electrodes requires a mounting equipment with high accuracy. Further, parts failing in the joining process could not be corrected and products containing such failure must be dumped.
According to the “mounting apparatus for flip chip components” described in the published specification of JP, 07-142545, A, as a prior art, the mounting apparatus was carried out using a method in which a state of bumps and a joining state thereof were confirmed by an infrared image pickup means before and after a flip chip IC was mounted, so that defective components were eliminated and only good components were sent to a next process. According to the prior mounting method, the flip chip IC sucked by a nozzle with a heater was moved and mounted to a predetermined position on the printed board. Immediately following this operation, picking up was performed by the infrared camera from below. Only joined parts of the circuit board were extracted from image data, and a positional deviation and join area of the joined parts were calculated and then compared with a preliminarily set allowance. A mount state was determined accordingly in the method.
On the other hand, in the “mounting apparatus for flip chip components” disclosed in the published specification of JP, 10-075096, A, a quantity and a shape of a conductive adhesive at the bump or a top part of the bump were measured with use of a CCD camera immediately before the flip chip IC was joined to a printed board, thereby deciding whether or not a state of the electrode was good. Only good components were hence joined to the printed board.
In the conventional techniques as above, that is, in the method of extracting the electrode shape of bumps of IC chip or the like with use of the infrared camera or CCD camera and processing images, the join state was able to be determined solely from an appearance such as the shape, area or the like of electrodes. Thus, there was a problem whether or not the bumps and electrode portions were truly joined was not correctly determined through visual inspection on the shape, area or the like.
Moreover, even if it was possible to tell failures by the shape, the failures could not be corrected with manipulation added. As a result, there was a problem that an improvement in yield could not be enhanced.
The present invention is devised to solve the above-described problems and has for its object
Akita Makoto
Eguchi Shinzo
Higashi Kazushi
Kametani Yasuhiro
Kanayama Shinji
Dunn Tom
Matsushita Electric - Industrial Co., Ltd.
Stoner Kiley
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