Bump forming method

Details Bump forming method Bump forming method

1997-03-10

1999-11-09

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 2281805, H01L 2144

Patent

active

059813717

ABSTRACT:
In a ball forming method used in manufacturing semiconductor devices, a ball is formed at the end of a bonding wire, this ball is pressed against an electrode of a semiconductor device and bonded to the electrode, a capillary is raised by a predetermined amount, and an ultrasonic vibration is applied to the capillary so that a portion of the wire located between the bonded ball and the lower end of the capillary is caused to undergo resonant vibration. This resonant vibration separates the wire from the bonding ball, thus leaving the ball on the electrode as a bump.

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patent: 5894983 (1999-04-01), Beck et al.
patent: 5897049 (1999-04-01), Nakamura et al.

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