Buffer of fine connection structure for connecting an atom level

Electronic digital logic circuitry – Interface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

326 63, H03K 190175

Patent

active

056940599

ABSTRACT:
A buffer circuit ID provided for connecting an atom level device (for example, an Atom Relay Transistor circuit), formed by arranging atoms in a predetermined pattern, to a device such as a semiconductor device and a quantum device. The buffer circuit can be formed as a voltage or current amplification circuit. The voltage amplification circuit may be a single electron transistor circuit, and the current amplification circuit may be an avalanche amplification device circuit. The Atom Relay Transistor circuit and the device such as a semiconductor device and a quantum device are formed substantially on the same flat insulating member, and connected by a fine connection structure made of a conductive body such as metal.

REFERENCES:
patent: 5244828 (1993-09-01), Okada et al.
patent: 5264711 (1993-11-01), Dutta et al.
patent: 5298760 (1994-03-01), Fuchs et al.
patent: 5327625 (1994-07-01), Clark, Jr. et al.
patent: 5365073 (1994-11-01), White
patent: 5381753 (1995-01-01), Okajima et al.
patent: 5426311 (1995-06-01), Webb
patent: 5436191 (1995-07-01), Paell et al.
Wada et al, "A proposal of nanoscale devices based on atom/molecule switching", J. Appl. Phys. 74 (12), 15 Dec. 1993, pp. 7321-7328.
"Integrated Circuit Packaging Technology", Nikkei BP, pp. 36-39, 1990.
Nature, vol. 344, Apr. 5, 1990, Eigler et al. "Positioning Single Atoms With a Scanning Tunnelling Microscope", pp. 524-526.
Elektronik, 21/1991, vol. 40, No. 21, Oct. 15, 1991, "Einzelnes Atom als Elektrischer Schalter"., p. 39.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Buffer of fine connection structure for connecting an atom level does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Buffer of fine connection structure for connecting an atom level, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Buffer of fine connection structure for connecting an atom level will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-804892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.