Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1979-12-21
1981-02-17
Smith, Ronald H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156657, 1566591, 156904, 427 96, 427259, 427261, 427282, 365 37, 365 39, B44C 122, G11C 1908, B05D 512
Patent
active
042513197
ABSTRACT:
A bubble memory chip is manufactured using the following processing steps:
REFERENCES:
patent: 3485665 (1969-12-01), De Angelo et al.
patent: 3626589 (1969-12-01), Vincent et al.
patent: 3808068 (1974-04-01), Johnson et al.
Reekstin et al., Fabrication of Large Bubble Circuits, IEEE Transactions on Magnetics, vol. Mag-9, No. 3, Sep. 1973.
Rose, Planar Processing for Magnetic Bubble Device, IEEE Transactions on Magnetics, vol. Mag-12, No. 6, Nov. 1976, pp. 618-621.
Bonnie G. Patrick
Schuster Steven C.
Bueker Richard
Control Data Corporation
Genovese Joseph A.
McGinnis William J.
Smith Ronald H.
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