Bubble memory chip and method for manufacture

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156657, 1566591, 156904, 427 96, 427259, 427261, 427282, 365 37, 365 39, B44C 122, G11C 1908, B05D 512

Patent

active

042513197

ABSTRACT:
A bubble memory chip is manufactured using the following processing steps:

REFERENCES:
patent: 3485665 (1969-12-01), De Angelo et al.
patent: 3626589 (1969-12-01), Vincent et al.
patent: 3808068 (1974-04-01), Johnson et al.
Reekstin et al., Fabrication of Large Bubble Circuits, IEEE Transactions on Magnetics, vol. Mag-9, No. 3, Sep. 1973.
Rose, Planar Processing for Magnetic Bubble Device, IEEE Transactions on Magnetics, vol. Mag-12, No. 6, Nov. 1976, pp. 618-621.

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