Bubble generating tunnels for cooling semiconductor devices

Details Bubble generating tunnels for cooling semiconductor devices Bubble generating tunnels for cooling semiconductor devices

1978-07-11

1980-05-13

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 80, 165 80C, 165105, 174 16HS, H01L 2504, H01L 3902

Patent

active

042031290

ABSTRACT:
A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned so that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels.

REFERENCES:
patent: 3790859 (1974-02-01), Schraeder
patent: 3972063 (1976-07-01), Kimura et al.
patent: 4027728 (1977-06-01), Kobayashi
patent: 4028783 (1977-06-01), Shikano et al.
patent: 4036291 (1977-07-01), Kobayashi et al.
patent: 4045245 (1977-08-01), Coleman et al.
patent: 4138692 (1979-02-01), Meeker et al.
IBM Technical Disclosure Bulletin; Promoting Nucleate Boiling of Semiconductors Devices in a Fluorocarbon Coolant; by Alcorn; vol. 20, No. 4, Sep. 1977, p. 1395.

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