Metal treatment – Compositions – Fluxing
Patent
1989-02-10
1990-04-24
Rosenberg, Peter D.
Metal treatment
Compositions
Fluxing
148 25, B23K 3534
Patent
active
049197312
ABSTRACT:
The present invention provides an electronic component part with terminal pins very closely and very strongly bonded to a high thermal conductivity ceramics circuit board and a method for simply and continuously manufacturing electronic component parts, with a high operability, each with terminal pins bonded to a high thermal conductivity ceramics circuit board. According to the present invention, an electronic component part is provided in which terminal pins are bonded to a high thermal conductivity ceramics circuit board by a brazing metal, containing at least one kind of Group IVa elements. In another aspect of the present invention a method is provided for manufacturing electronic component parts, which comprises the step of attaching terminal pins to a high thermal conductivity ceramics circuit board by a brazing paste layer comprised of brazing metal powder containing at least one kind of Group IVa elements, an acrylic binder with a carboxylic group as a substituent group and organic solvent, and heating the resultant structure in an atmosphere containing nitrogen as a principal element so that terminal pins are firmly bonded to a circuit board.
REFERENCES:
patent: 2158984 (1939-05-01), Lytle
patent: 4325754 (1982-04-01), Mizuhara
Patent Abstracts of Japan, vol. 9, No. 150 (E-324)[1873], Jun. 25, 1985; & JP-A-60 32 343 (Toshiba K.K.) 19-02-1985.
Iwase Nobuo
Iyogi Kiyoshi
Nakahashi Masako
Takeda Hiromitsu
Yanazawa Toshirou
Kabushiki Kaisha Toshiba
Rosenberg Peter D.
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