Bottom conductor for integrated MRAM

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S314000, C257SE21665

Reexamination Certificate

active

11215276

ABSTRACT:
A structure that is well suited to connecting an MTJ device to a CMOS integrated circuit is described. It is built out of three layers. The bottom layer serves as a seed layer for the center layer, which is alpha tantalum, while the third, topmost, layer is selected for its smoothness, its compatibility with the inter-layer dielectric materials, and its ability to protect the underlying tantalum. A method for its formation is also described.

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“Nanoscale Diffusion Barriers for Copper Metallization”, by Traving et al., Semiconductor Int'l, Jul. 2003.
Co-pending U..S. Patent App. HT-04-048A, filed Mar. 15, 2005, U.S. Appl. No. 11/080,868 and HT-04-048B, filed Mar. 15, 2005, U.S. Appl. No. 11/080,860, both assigned to the same assignee as the present invention, Mar. 15, 2005.

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