Boron etch-stop layer and methods related thereto

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or...

Reexamination Certificate

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C257S616000, C257S655000, C257SE21232, C438S758000, C438S740000, C438S752000

Reexamination Certificate

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07569913

ABSTRACT:
A method for forming an etch-stop layer and a resulting structure fabricated therefrom. The etch-stop layer has a semiconductor layer having a first surface and a boron layer formed below the first surface of the semiconductor layer. The boron layer has a full-width half-maximum (FWHM) thickness value of less than 100 nanometers. The boron layer is formed by a chemical vapor deposition (CVD) system.

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