Bondwire utilized for coulomb counting and safety circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S692000, C257S516000, C257S358000, C257SE27016, C257SE27024

Reexamination Certificate

active

07550806

ABSTRACT:
A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.

REFERENCES:
patent: 6150714 (2000-11-01), Andreycak et al.
patent: 6424035 (2002-07-01), Sapp et al.

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