Bonding pad with circular exposed area and method thereof

Details Bonding pad with circular exposed area and method thereof Bonding pad with circular exposed area and method thereof

1993-11-16

1994-11-22

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156644, 257774, 257784, 437183, 437203, 437238, 437241, B44C 122, C03C 1500, C03C 2506

Patent

active

053665899

ABSTRACT:
A bonding pad is covered by an passivation layer to provide insulation and anti-corrosion protection. The passivation layer over the bonding pad is etched away to expose a circular area of the bonding pad where the bonding wire is attached. By shaping the passivation layer on top of the metal area in the form of a smooth curvature, there are no sharp edges. The circular exposed metal area minimizes the electric field density produced by application of a high voltage to the bonding pad and thereby avoids breakdown of the passivation layer.

REFERENCES:
patent: 5244833 (1993-09-01), Gansauge et al.
patent: 5266446 (1993-11-01), Chang et al.

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