Bonding pad structure, electronic device having a bonding...

Details Bonding pad structure, electronic device having a bonding... Bonding pad structure, electronic device having a bonding...

2008-01-30

2010-06-29

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S612000, C257SE21499

Reexamination Certificate

active

07745255

ABSTRACT:
An electronic device having a bonding pad structure and a method of fabricating the same is provided. The electronic device may include a first bonding pads formed on the substrate. A second bonding pad may be formed on the lower insulating layer. The second bonding pads may be spaced apart from the first bonding pads. The second bonding pads may have a top surface formed at a higher level than the first bonding pads.

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patent: 7495319 (2009-02-01), Fukuda et al.
patent: 2002/0155672 (2002-10-01), Wang et al.
patent: 2006/0166402 (2006-07-01), Lim et al.
patent: 10-163635 (1998-06-01), None
patent: 2001-326241 (2001-11-01), None
patent: 10-1997-0052402 (1997-07-01), None

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