Bonding pad and via structure design

Details Bonding pad and via structure design Bonding pad and via structure design

2006-04-04

2006-04-04

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S758000, C257S762000, C257S773000, C257S775000, C257S776000

Reexamination Certificate

active

07023090

ABSTRACT:
A bonding pad design, comprising: a substrate; a lower series of metal pads upon the substrate; and an intermediate series of metal pads over the lower series of metal pads. The lower series of metal pads and the intermediate series of metal pads being connected by a respective series of intermediate interconnects and each series of intermediate metal pads being interlocked by a respective series of extensions.

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