Bonding option circuit having no pass-through current

Details Bonding option circuit having no pass-through current Bonding option circuit having no pass-through current

1995-11-29

1997-10-28

Westin, Edward P.

Electronic digital logic circuitry

Signal sensitivity or transmission integrity

Bus or line termination

326 38, 326 83, 326 87, 327198, 327313, H03K 190948

Patent

active

056821050

ABSTRACT:
A bonding option circuit comprises a logic gate circuit connected between a bonding pad and a power supply voltage, a load capacitance connected between ground and the logic gate circuit, and an output stabilizer circuit having an input connected to the bonding pad and an output connected to an output terminal. The logic circuit is so configured that when the bonding pad is in a floating condition, the logic circuit connects the bonding pad to the power supply voltage, and when the bonding pad is bonded to the ground, the logic circuit disconnects a current path between the bonding pad and the power supply voltage.

REFERENCES:
patent: 4307306 (1981-12-01), Kucharewski
patent: 5329174 (1994-07-01), Chiang
patent: 5412333 (1995-05-01), Okunga
patent: 5420526 (1995-05-01), Fensch

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