Bonding-option architecture for integrated circuitry

Details Bonding-option architecture for integrated circuitry Bonding-option architecture for integrated circuitry

1998-03-25

2000-03-07

Tokar, Michael

Electronic digital logic circuitry

Multifunctional or programmable

Having details of setting or programming of interconnections...

326 38, 326 39, 326 41, 326 47, 326101, 326 37, H03K 19173, H03K 19177

Patent

active

06034539&

ABSTRACT:
A bonding-option architecture is provided for use on an IC package for bonding option selections. The bonding-option architecture includes an option pad and a plurality of bonding entries connected to the option pad, each of the bonding entries being arranged in immediate proximity to one of the bonding points. In this bonding-option architecture, at least a first one of the bonding points is connected via a first one of the pins to an external power point and at least a second one of the bonding points is connected via a second one of the pins to an external ground point when the IC package is mounted on a circuit board. In the case when a high-voltage state logic signal is to be set via the option pad into the internal circuit of the IC chip, the first one of the bonding points is wired to the proximate one of the bonding entries; and in the case when a low-voltage state logic signal is into be set via the option pad to the internal circuit of the IC chip, the second one of the bonding points is wired to the proximate one of the bonding entries.

REFERENCES:
patent: 5353250 (1994-10-01), McAdams
patent: 5412333 (1995-05-01), Okunaga
patent: 5682105 (1997-10-01), Fujima
patent: 5880596 (1999-03-01), White
patent: 5920227 (1999-07-01), An

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