Bonding of light emitting diodes having shaped substrates

Details Bonding of light emitting diodes having shaped substrates Bonding of light emitting diodes having shaped substrates

2004-04-27

2008-03-11

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Using high frequency vibratory energy

C228S245000

Reexamination Certificate

active

07341175

ABSTRACT:
Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.

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