Bonding method of semiconductor device

Details Bonding method of semiconductor device Bonding method of semiconductor device

1986-05-14

1987-06-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156668, 427 88, B29C 3700, B44C 122, C03C 1500, C03C 2506

Patent

active

046768645

ABSTRACT:
A bonding method of semiconductor device by using a film carrier; A heat-resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by plating using the heat-resistive insulating layer as a mask; After transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.

REFERENCES:
patent: 3751292 (1973-08-01), Kongable
patent: 4070230 (1978-01-01), Stein
patent: 4310570 (1982-01-01), Calviello

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