Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-07-09
1996-04-02
Gallagher, John J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
106 126, 106 128, 156281, 156325, 156327, 228198, 437209, 524176, 524403, B32B 3100
Patent
active
055036988
ABSTRACT:
A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
REFERENCES:
patent: 2566339 (1951-09-01), Klinker
patent: 2945295 (1960-07-01), Feaster
patent: 3069765 (1962-12-01), Simpelaar
patent: 4102192 (1978-07-01), Smith et al.
patent: 4574095 (1986-03-01), Baum et al.
patent: 4701351 (1987-10-01), Jackson
patent: 4734481 (1988-03-01), Steinmann
Auerbach, "Method for Reducing Metal Salts Complexed in a Polymer Host With a Laser", J. Electrochem. Soc.: Solid-State Science and Technology, Jun. 1985, vol. 132, No. 6, pp. 1437-1440.
Ohuchi et al. "Planar LSI Interconnection Method Utilizing Polymeric Conductor", IMC 1986 Proceedings, Kobe, May 28-30, 1986, pp. 127-131.
Auerbach, "A New Scheme for Device Packaging", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-8, No. 3, Sep. 1985, pp. 309-312.
Hsu et al., "The Wire Bondability of Thick Film Gold, Sputtered Thin Film Gold and Metallo-Organic Thin Film Gold, Proceedings", 1985 International Symposium on Microelectronics, Int. Soc. Hybrid Microelectronics, Anaheim, CA, 11-15 Nov. 1985, pp. 428-434.
Needes et al., "Thick Film Materials For Copper Hybrid Circuits", IMC 1986 Proceedings, Kobe, May 28-30, 1986, pp. 239-248.
Houle et al., "Laser Chemical Vapor Deposition of Copper", Appl. Phys. Letter, vol. 46, No. 2, 15 Jan. 1985, pp. 204-206.
Baum et al., "Laser Chemical Vapor Deposition of Gold", Appl. Phys. Letter, vol. 47, No. 5, 1 Sep. 1985, pp. 538-540.
Goldberg Martin J.
Ito Hiroshi
Kovac Caroline A.
Palmer Michael J.
Pollak Roger A.
Gallagher John J.
International Business Machines - Corporation
LandOfFree
Bonding method employing organometallic interconnectors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding method employing organometallic interconnectors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding method employing organometallic interconnectors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2013954