Bonding method

Details Bonding method Bonding method

2006-06-13

2006-06-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000

Reexamination Certificate

active

07060521

ABSTRACT:
The present invention relates to a method to form an integrated device, said device comprising a first substrate and at least one element provided on a second substrate. A bonding material is arranged on at least one of said substrates. Said first and second substrates are joined together. At least one recess is provided through at least said first substrate and said material. Support structures are provided in at least a part of said at least one recess to mechanically and/or electrically interconnect said at least one element on said second substrate and said first substrate. At least one element out of said first substrate is formed to be mechanically and/or electrically connectable to said at least one support structure. At least a portion of said material between said first and second substrates is stripped away to make said element on said first substrate movable.

REFERENCES:
patent: 5241211 (1993-08-01), Tashiro
patent: 5415726 (1995-05-01), Staller et al.
patent: 6201631 (2001-03-01), Greywall
patent: 6452712 (2002-09-01), Atobe et al.
Foreign search report.

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