Bonding interface for micro-device packaging

Details Bonding interface for micro-device packaging Bonding interface for micro-device packaging

2005-04-21

2009-11-03

Coleman, W. David (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE21499

Reexamination Certificate

active

07611919

ABSTRACT:
In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.

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