Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1997-12-19
1999-03-23
Acquah, Samuel A.
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
528 86, 525423, 525430, 525432, 525534, 525540, 522134, 428221, 428357, 4284231, 4284744, 428901, B32B 1508, C08F28304
Patent
active
058857230
ABSTRACT:
Provided is bonding film for printed circuit boards which is resistant to cracking even when bent with a small radius of curvature, has a sufficient mechanical strength even in its semi-cured state so that the handling may be facilitated, is not undesirably brittle and therefore does not produce undesired debris when cut, and is flexible and flame retardant at the same time. The bonding film may consist of (i) high polymer epoxy resin; (ii) denatured polyamide obtained by reacting epoxy resin and polyamide; (iii) polyfunctional epoxy resin; and (iv) curing agent. Preferably, the denatured polyamide includes a polyalkylene-glycol residue or a polycarbonate-diol residue. Preferably, the high polymer epoxy resin is produced by the polymerization of bifunctional epoxy resin and bifunctional phenol resin, and has a weight averaged molecular weight equal to 50,000 or higher.
Hirakura Hiroaki
Hirayama Takao
Hirosawa Kiyoshi
Ito Toshihiko
Kida Akinari
Acquah Samuel A.
Hitachi Chemical Company Ltd.
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