Bonding a metal component to a low-k dielectric material

Details Bonding a metal component to a low-k dielectric material Bonding a metal component to a low-k dielectric material

2005-01-25

2005-01-25

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S782000, C438S783000

Reexamination Certificate

active

06846755

ABSTRACT:
A dielectric material is strengthened by bonding a metal component to the dielectric matrix. The metal component may be a metal oxide or metal oxide precursor. The metal component may be deposited on the substrate with the dielectric material, or sol-gel chemistry may be used and the liquid solution spin-coated on a substrate.

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Laughlin et al., “Using Sol-Gel Chemistry to Synthesize a Material with Properties Suited for Chemical Sensing”, Journal of Chemical Education, vol. 77, No. 1, pp. 77-79, Jan. 2000.

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