Bondhead alignment tool for a bonding apparatus

Details Bondhead alignment tool for a bonding apparatus Bondhead alignment tool for a bonding apparatus

2008-02-26

2010-12-14

Koch, III, George R (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

C156S358000, C156S360000

Reexamination Certificate

active

07849896

ABSTRACT:
An alignment tool for a bonding apparatus comprises a loading surface for receiving a pushing force from a surface of a device which is attached to the bonding apparatus, the loading surface being arranged and constructed to experience a tilting moment upon receiving an unequally distributed pushing force from a misaligned device acting on it. The loading surface transmits the tilting moment experienced by it to a sensing surface which is operatively connected to the loading surface through a columnar body, which has a smaller width than the loading surface and the sensing surface, and which connects the loading surface and the sensing surface. An array of piezoelectric elements communicates with the sensing surface and produces electrical signals in response to the tilting moment such that a computing unit operatively connected to the piezoelectric elements may detect a direction of tilt of the loading surface from the electrical signals produced by the piezoelectric elements.

REFERENCES:
patent: 6179938 (2001-01-01), Mannhart et al.
patent: 6990867 (2006-01-01), Okada
patent: 7066373 (2006-06-01), Behler
patent: 7240711 (2007-07-01), Chan et al.
patent: 2004/0159166 (2004-08-01), Schiller
patent: 2004/0187593 (2004-09-01), Okada
patent: 2005/0155712 (2005-07-01), Chan et al.

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