Bonded structures for use in semiconductor processing...

Details Bonded structures for use in semiconductor processing... Bonded structures for use in semiconductor processing...

2005-08-16

2005-08-16

Kramer, Dean J. (Department: 3652)

Handling: hand and hoist-line implements

Utilizing fluid pressure

By positive fluid stream directed against article

C294S001200, C414S941000

Reexamination Certificate

active

06929299

ABSTRACT:
A structure for use in a semiconductor processing environment is provided, including a first plate a second plate bonded to the first plate. A distal end of the second plate extends beyond a distal end of the first plate. The distal end of the first plate is tapered along a length at least one-half of a width of the first plate adjacent the tapered distal end of the first plate.

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