Bond wire configuration and injection mold for minimum wire swee

Details Bond wire configuration and injection mold for minimum wire swee Bond wire configuration and injection mold for minimum wire swee

1991-04-26

1992-10-13

Hille, Rolf

Electrical audio signal processing systems and devices

Hearing aids, electrical

Specified casing or housing

357 68, 357 72, 381421, 174 524, 439 68, 439 70, H01L 2302, H01L 2312

Patent

active

051555786

ABSTRACT:
The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 4618879 (1986-10-01), Mizukoshi et al.
patent: 4768070 (1988-08-01), Takizawa et al.
patent: 4890153 (1989-12-01), Wu
patent: 4916506 (1990-04-01), Gagnon
patent: 4959706 (1990-09-01), Cusack et al.

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