Bond pad structure for the via plug process

Details Bond pad structure for the via plug process Bond pad structure for the via plug process

1997-09-15

1999-07-13

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257774, 257781, 257786, H01L 23522

Patent

active

059230886

ABSTRACT:
A bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45.degree. with respect to the square metal pads.

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patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5739587 (1998-04-01), Sato

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