Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-08-14
2000-02-01
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
216 67, 216 79, 438714, 438721, 438735, H01L 2100
Patent
active
06020270&
ABSTRACT:
A process for etching single crystal silicon, polysilicon, silicide and polycide using iodinate or brominate gas chemistry, is disclosed. The iodinate/brominate gas chemistry etches narrow deep trenches with very high aspect ratios and good profile control and without black silicon formation or other undesirable phenomena.
REFERENCES:
patent: 3669774 (1972-06-01), Dismukes
patent: 3925120 (1975-12-01), Saida et al.
patent: 3994793 (1976-11-01), Harvilchuck et al.
patent: 4026742 (1977-05-01), Fijino
patent: 4141765 (1979-02-01), Druminski et al.
patent: 4184909 (1980-01-01), Chang et al.
patent: 4351696 (1982-09-01), Radigan
patent: 4374698 (1983-02-01), Sanders et al.
patent: 4422897 (1983-12-01), Horwitz
patent: 4431477 (1984-02-01), Zajac
patent: 4450042 (1984-05-01), Purdes
patent: 4473436 (1984-09-01), Beinvogl
patent: 4490209 (1984-12-01), Hartman
patent: 4492610 (1985-01-01), Okano et al.
patent: 4502915 (1985-03-01), Carter et al.
patent: 4505782 (1985-03-01), Jacob et al.
patent: 4581099 (1986-04-01), Fukaya et al.
patent: 4613400 (1986-09-01), Tam et al.
patent: 4623417 (1986-11-01), Spencer et al.
patent: 4624728 (1986-11-01), Bithell et al.
patent: 4631106 (1986-12-01), Nakazato et al.
patent: 4632719 (1986-12-01), Chow et al.
patent: 4648936 (1987-03-01), Ashby et al.
patent: 4648938 (1987-03-01), Ashby et al.
patent: 4657628 (1987-04-01), Holloway et al.
patent: 4668338 (1987-05-01), Maydan et al.
patent: 4668729 (1987-05-01), Foster et al.
patent: 4690729 (1987-09-01), Douglas
patent: 4698900 (1987-10-01), Esquivel
patent: 4702795 (1987-10-01), Douglas
patent: 5007982 (1991-04-01), Tsou
Hirobe et al, "Reduction of Radiation Damage on silicon substrates in Magnetron REactive Ion Etching", J. Electrochem. Soc. Solid State Science and Technolo. Apr., 1985, pp938-942.
Gregor et al, "Vapor Phase Polishing of Silicon with H2HBr Gas Mixtures" IBM J. Jul., 1965, pp327-332.
Flamm et al, "Etching and film formation in CF3Br plasmas: Some qualitativwe observations and their general implications", J. Vac. Sci. Technol. 17)6 Nov./Dec. 1980 pp 1341-1347.
Miyamura et al, "Adsorption on HCl and HBr on Si(111)); aes,els and eid sTUDIES", sURFACE sCL 72 (1978) pp 243-252.
Matsuo, "Selective etching on Si relative to SiO2 without unercutting by CBrF3 plasma", Appl. Phy. Lett. 36(9) May, 1980, pp 768-770.
Schaible et al, "Reactive ion etching of aluminum and aluminum alloys in an rf plasma containing halogen species", J. Vac. Sci Technol. 36(2) Mar./Apr. 1976.
Kern, Chemical Etching of Silicon, Germanium, Gallium Arsenide and Gallium Phosphidez, RCA Review vol. 39, Jun. 1978, pp 278-308.
Tachi et al, "Chemical sputtering of silicon by F+. Cl+ and Br+ ions: Reactive spot model for reactive ion etching", J. Vac. Sci. Technol. B4(2) Mar./Apr. 1986, pp 459-467.
Chang Mei
Mak Alfred W.
Maydan Dan
Wang David Nin-Kou
Wong Jerry Yuen Kui
Applied Materials Inc.
Morris Birgit
Powell William
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