Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2003-12-22
2008-11-18
Menz, Laura M (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S288000
Reexamination Certificate
active
07453121
ABSTRACT:
An SOI device (100) has a gate electrode with one or more additional gate regions (120), and oxygen or halogen ions (128) under the additional gate regions (120). The oxygen or halogen ions (128) form thicker gate oxide regions or shallow trench isolation regions.
REFERENCES:
patent: 6074908 (2000-06-01), Huang
patent: 6248637 (2001-06-01), Yu
patent: 6297103 (2001-10-01), Ahn et al.
patent: 6335262 (2002-01-01), Crowder et al.
patent: 6413802 (2002-07-01), Hu et al.
patent: 6420218 (2002-07-01), Yu
patent: 6432829 (2002-08-01), Muller et al.
patent: 6525403 (2003-02-01), Inaba et al.
patent: 6720221 (2004-04-01), Ahn et al.
patent: 6794709 (2004-09-01), Ahn et al.
patent: 6833308 (2004-12-01), Ahn et al.
patent: 6905919 (2005-06-01), Chan et al.
patent: 6998682 (2006-02-01), Chan et al.
patent: 7271467 (2007-09-01), Noble et al.
patent: 2002/0004276 (2002-01-01), Ahn et al.
patent: 2002/0004277 (2002-01-01), Ahn et al.
patent: 2003/0094660 (2003-05-01), Crowder et al.
patent: 2005/0023608 (2005-02-01), Chan et al.
patent: 2005/0133831 (2005-06-01), Cheng et al.
patent: 2005/0208712 (2005-09-01), Chan et al.
patent: 2007/0018247 (2007-01-01), Brindle et al.
patent: 2007/0181947 (2007-08-01), Chan et al.
Y.C. King ewt al., “Sub-5um Multiple Thickness Gate Oxide Technology Using Oxygen Implantation,” Int. Electron Device Meeting (IEDM), San Francisco, paper 21.1.1, 1998).
B. W. Min et al., “Reduction Of Hysteretic Propagation Delay With Less Performance Degradation By Novel Body Contact in PD SOI Application”, 2002 IEEE International SOI Conference, Oct. 2002, pp. 169-170.
Cheng Shui-Ming
Fung Ka-Hing
Wang Yin-Pin
Duane Morris LLP
Menz Laura M
Taiwan Semiconductor Manufacturing Co. Ltd.
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