BOC BGA package for die with I-shaped bond pad layout

Details BOC BGA package for die with I-shaped bond pad layout BOC BGA package for die with I-shaped bond pad layout

2006-09-26

2006-09-26

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S125000, C425S129100

Reexamination Certificate

active

07112048

ABSTRACT:
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.

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