Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-07-17
1999-07-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439660, H01R 909
Patent
active
059217871
ABSTRACT:
An interconnection providing multiple electrical interconnections at a fine pitch can be formed in a pluggable and unpluggable form having a pitch on the order of 0.8 mm, using four rows of contact elements in each of the plug and socket which are in a continuous row and not staggered along the row with other contact elements, making the interconnection easier to manufacture and utilize.
REFERENCES:
patent: 4418974 (1983-12-01), MacDougall
patent: 4804336 (1989-02-01), Miller et al.
patent: 5098311 (1992-03-01), Roath et al.
patent: 5145407 (1992-09-01), Obata et al.
patent: 5154627 (1992-10-01), Lee
patent: 5181855 (1993-01-01), Mosanera et al.
patent: 5241451 (1993-08-01), Walburn et al.
patent: 5263867 (1993-11-01), Doi et al.
patent: 5376009 (1994-12-01), Olsson et al.
patent: 5380225 (1995-01-01), Inaoka
patent: 5433616 (1995-07-01), Walden
patent: 5542851 (1996-08-01), Chikano
patent: 5618191 (1997-04-01), Chikano et al.
patent: 5641290 (1997-06-01), Yagi
patent: 5697799 (1997-12-01), Consoli et al.
patent: 5733142 (1998-03-01), Clark
Cherney Thomas M.
Gonzalez Adalberto
Hardcastle David S.
Ploehn Guenter
Pope Richard A.
Abrams Neil
McNutt Matthew B.
Minnesota Mining and Manufacturing Company
Patel T C
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