Board for evaluating the characteristics of a semiconductor chip

Details Board for evaluating the characteristics of a semiconductor chip Board for evaluating the characteristics of a semiconductor chip

1996-10-17

2000-07-25

Karlsen, Ernest

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439 71, G01R 1073, G01R 3102

Patent

active

060940573

ABSTRACT:
A board body constituting a characteristic evaluation board has a holding section for holding a semiconductor chip therein. The semiconductor chip has a plurality of bumps. The respective bumps of the semiconductor chip are set in contact with corresponding electrodes with the semiconductor chip held in the holding section in the board body. Clamping mechanisms are located on the surface of the board body in the neighborhood of the holding section. The clamping mechanisms press the semiconductor chip held in the holding section. The respective bumps on the semiconductor chip are pressure contacted with the corresponding electrodes. Since the respective bumps are pressure contacted with the corresponding electrodes without using a solder, the respective bumps can be formed of an eutectic solder. The semiconductor chip held in the holding section can readily be taken out of the holding section by opening the clamping mechanisms.

REFERENCES:
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4620761 (1986-11-01), Smith et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5320550 (1994-06-01), Uratsuji et al.
patent: 5374197 (1994-12-01), Uratsuji
patent: 5493237 (1996-02-01), Volz et al.
patent: 5557212 (1996-09-01), Isaac et al.
patent: 5748007 (1998-05-01), Gaschke
patent: 5767689 (1998-06-01), Tokuno et al.
patent: 5923179 (1999-07-01), Taylor

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