Board design aiding apparatus, board design aiding method...

Details Board design aiding apparatus, board design aiding method... Board design aiding apparatus, board design aiding method...

2007-05-22

2007-05-22

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C324S537000, C703S001000

Reexamination Certificate

active

10986135

ABSTRACT:
A board design aiding apparatus that simplifies a designed printed wiring board to predict a displacement quantity of the printed wiring board includes a layer thickness calculation section21for obtaining a mean thickness of an area of a board by a prescribed rule for an essential material forming a layer at each layer for constructing the printed wiring board, and a laminate model forming section22for forming a simple laminate model by laminating layers having layer thickness calculated by the layer thickness calculation section21.

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patent: 7069095 (2006-06-01), Nelson et al.
patent: 2003/0196181 (2003-10-01), Sano et al.
patent: 2004/0010766 (2004-01-01), Swope
patent: 2005/0008319 (2005-01-01), Cameron
patent: 04-360274 (1992-12-01), None
patent: 10-093206 (1998-04-01), None

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