Blocking shield and method for contouring the thickness of sputt

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204298, C23C 1500

Patent

active

044366027

ABSTRACT:
A method of sputter depositing a desired film thickness profile on a substrate is accomplished by depositing material onto a substrate at spaced apart coating stations whereby a substrate at any of said stations is not coated by the sputter coating action at any of the other sputter stations. The substrate is held stationary during complete sputtering at each station. A blocking shield is placed in fixed position between the substrate and the sputter coating source at one or more of the stations. The duration of sputter coating time at one station may be different than at another station.

REFERENCES:
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patent: 3740327 (1973-06-01), Lane et al.
patent: 3829373 (1974-08-01), Kuehnle
patent: 3856654 (1974-12-01), George
patent: 3864239 (1975-02-01), Fletcher
patent: 3897324 (1975-07-01), Del Monte et al.
patent: 3904503 (1975-09-01), Hanfmann
patent: 4100055 (1978-07-01), Rainey
patent: 4294678 (1981-10-01), Kuehnle
patent: 4315960 (1982-02-01), Ohji et al.

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